Small Outline Package(SOP)

Category： Small Out-Line Package(SOP)
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Product Description:

Doris（HK）Technology Co., Limited, Small-outline (SO) packages include a dual row surface mount configuration with a wide variety of sizes and variations including SOIC, SOT, and all SOP spins (SSOP, TSSOP, VSSOP/MSOP). High utilization across many industries and high reliablity makes this a standard package well-suited for numerous applications, including automotive and industrial. Packages are available with or without an exposed pad, depending on thermal and electrical requirements.

Tags: Small Outline Package(SOP)